modusAOI S3-ITM-R

Triple THT Inspection


The triple AOI system is designed for simultaneous inspection at the return conveyor and from top and bottom before and after wave soldering oven. It has three multi-LED illuminated scanner units as well as our patented lenses which generate parallax free images. The System includes three modus control units. The transport module has a length of 1200mm (47.2 in.).

Characteristics

Triple system for simultaneous inspection of top and bottom before and after the soldering process.

Optional automatic cleaning of the lower inspection area with an air knife

Combination of different inspection tasks such as SMD placement, THT solder joints, conformal coating and full screening for solder beads (solder balls).

Capture of any number of barcodes and data- matrix codes on the multi PCB.

Technical information


Scan Unit
  • Resolution: 600 - 1200 dpi, 42μm - 21μm
  • Color depth 3 x 12 bit internal, 3 x 8 bit external
  • Light source: multi-LED illumination
  • Optional: UV LED Cluster 365nm focused
  • Solder meniscus control with blue-red-white LED cluster based on different illumination angles
  • Adjustable illumination profiles
  • Triggered light control
  • Telecentric lens for a parallax free image
  • Rectified image due to orthogonal calibration
  • Optional: Conformal coating thickness calibration
System-PC
  • Intel Core i7 4.2GHz 7th-Generation,
  • 32GB DDR4-RAM,
  • DVD- Writer,
  • 2 x 1Gb/s Network interface,
  • I/O module,
  • 2 x 6TB HDD’s (NAS 24/7),
  • 1 x 500GB V-NAND SSD NVMe M.2,
  • Windows 10 Professional/LTSB 64Bit,
  • Acronis Backupsoftware,
  • Keyboard,
  • Mouse,
  • Operator Keyboard,
  • 24“ Full-HD IPS 16:9 Monitor
Operating Range
  • PCB area 420 mm x 530 mm (16.5 in. x 20.8 in.)
  • Clearance BOT min 40mm, TOP up to 150mm [ 1.6 in. 5.9 in.]
Inspection Speed

Full area independent of the number of inspection parts:
25 seconds (including calculation time). Smaller scan area means less inspection time.

Scan Unit
  • Resolution: 600 - 1200 dpi, 42μm - 21μm
  • Color depth 3 x 12 bit internal, 3 x 8 bit external
  • Light source: multi-LED illumination
  • Optional: UV LED Cluster 365nm focused
  • Solder meniscus control with blue-red-white LED cluster based on different illumination angles
  • Adjustable illumination profiles
  • Triggered light control
  • Telecentric lens for a parallax free image
  • Rectified image due to orthogonal calibration
  • Optional: Conformal coating thickness calibration
Transport System and inline Integration

System independent interface for conveyor module Standard-inline system with any conveyer drive and soft stop Double or triple system for simultaneous inspection on the return conveyor and from top and bottom before the oven
Various options and custom solutions can be realized

Dimensions and Weight
  • Width 1200 mm x depth 1450 mm,
  • height 1352 mm,
  • weight 410 kg (47.2 in. x 57.03 in. x 53.18 in. - 902 lbs.)