The latest generation of the modus scanner, S1 or MLD1200 captures the images in one pass, one or both sides of the PCB from 300 mm x 400 mm, up to 420 mm x 550 mm in a timeframe of 3 to 25 seconds maximum. This applies for all processes, solder paste (SPI), post placement (pre reflow), post reflow or post wave (PTH) inspection with a scanning resolution of max. 1200 dpi and a structure resolution of 21 μm.
