For an integrated, pre-post-reflow inspection solution production process, the development of a new optical test system integrated at top side conveyor location. The modus AOI MLD1200-IXA/IXN checks SMD parts before reflow and solder joints after reflow process. The reliable identification of missing or nonadjusted parts as well as floating components will be reliable indicated. Open or incomplete solder joints, solder bridges, missing pins as well as the shape of the solder joint from the post reflow will be indicated down to 0402 component size. The modus AOI offers the additional benefit that expensive flip stations are not required. The gain of space allows simultaneous inspection of the boards from top and/or bottom. At the repair station, the fault data is displayed, the repair is documented and fault condition confirmed. This information, feedback through SPC data help to improve and optimize process control.
Traceability using Barcode or Data-Matrix codes is supported and can be collected by the AOI from top as well as from bottom with the modus double-sided system. The modus S1-IDA is available as either in-line or off-line. They have been developed over the years based on customer needs and requests and they are offered exclusively by modus High-Tech. Modus AOI systems, saves time, space and therefore money. The typical pay-back period is between eight to twelve months.